半導體封裝(SEMICONDUCTOR PACKAGE）
Slit方式塗布設備『Linearcoater™』展開於面板級封裝(FOPLP)
The Linearcoater™ slit-type coating system has been relaunched for manufacturing advanced semiconductor packages
自2012年起應用優異的塗布技術，致力開發FOPLP(Fan Out Panel Level Package)扇形面板級先進封裝的製程，以因應未來的需求。
能源產業ENERGY INDUSTRY
可對應於車載用的大型高性能，鋰二次電池之量產
Suitable for production of high-spec. LiB for electric vehicles.
應用電極塗布，搭配獨自研發的烘烤技術，可降低製程時間，無疑是R2R(Roll To Roll)設備的最佳選擇。
貼合設備 LAMINATION EQUIPMENT
對應於Metal meshes以及Force Touch 多功能膜對策應用Inline設備
An inline system designed for multifunction film solutions such as metal meshes and Force Touch
針對軟性的基板可對應於Metal meshes及Force Touch等多功能膜產品實現全自動化捲到片的貼合需求。
實現軟板終端裝置之膜貼合(Lamination)機械剥離(Delamination)的連續處理
The SL-1000G is able to perform sequential lamination and mechanical delamination of films for flexible devices.
針對軟性基板的終端產品需求可實現膜的貼合與機械剝離連續處理的半自動或全自動設備。
DISPLAY用WET LINE（面板顯示器用濕式設備）
大型TFT ARRAY 製程所採用之WET設備
Tried and true wet processing system for large TFT arrays.
枚葉式濕式蝕刻設備，採用各種Spray + Nozzle可選擇傾斜或是水平搬送方式可實現優越的蝕刻處理。
枚葉式光阻剝離設備，採用Multi Scan Jet剝離工具以及傾斜式搬送方式可實現高強度剝離性能。
枚葉式SPUTTER設備
搭載高密度Plasma之真空成膜設備
Vacuum Deposition with LIA high-density plasma source.
枚葉式塗布裝置 LC-M550G/750G
將Slit塗布裝置「Linearcoater™」推展到Panel Level Package (FOPLP)
The Linearcoater™ slit-type coating system has been relaunched for manufacturing advanced semiconductor packages.
我們已經將世界佔有率No.1的TFT Array用Slit 塗布装置「Linearcoater™」推展到Panel Level Package。
並且可以Inline到曝光／TMAH顯影等處裡裝置。
Specifications
| Model name | LC-M550G | LC-M750G |
|---|---|---|
| Coating method | Slit coating (Die coating) | |
| Coating chemical | Platting resist, photosensitive insulting material, PI, PBO, temporary adhesive, mold lubricant | |
| Panel | Glass or mold (For film and foil, please contact us.) | |
| Substrate size | Max. 515x510mm | Max. W600xL600mm |